Encapsulation
Pen, 0.32oz (9g)(1)
(5)
Multiple choices
Packaging
(6)
Multiple choices
Model/Brand/Package
Category/Description
Inventory
Price
Data
  • Encapsulation:
    Category: soldering station
    Description: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
    1414
    Get WhatsApp Quote
    BOM Quote
  • Encapsulation:
    Category: soldering station
    Description: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
    4880
    Get WhatsApp Quote
    BOM Quote
  • Encapsulation:
    Category: soldering station
    Description: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
    7784
    Get WhatsApp Quote
    BOM Quote
  • Encapsulation:
    Category: soldering station
    Description: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
    3586
    Get WhatsApp Quote
    BOM Quote
  • Encapsulation:
    Category: soldering station
    Description: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
    4554
    Get WhatsApp Quote
    BOM Quote
  • Encapsulation: Pen, 0.32oz (9g)
    Category: soldering station
    Description: 9g (0.32oz) Can be easily removed using lead-free soldering flux cleaner, please refer to pen 508-6380
    7052
    Get WhatsApp Quote
    BOM Quote

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